The water-cooled plate adopts passive liquid cooling for heat conduction. Heat generated by heat sources (such as IGBT modules, CPUs, and battery cells) is first transferred to the surface of the black metal substrate. After the substrate absorbs heat, it rapidly transfers the heat to the circulating cooling liquid inside the tubes through the tightly bonded copper tube walls within it. After absorbing the heat, the cooling liquid flows to an external radiator (such as a cooling radiator or heat exchanger), thus achieving continuous cooling of the equipment.