The fins used on server radiators serve as the efficiency core of air cooling. Their design strikes a comprehensive balance among material (thermal conductivity and weight), manufacturing process (structural integrity and cost), and structure (heat dissipation area and wind resistance). The ultimate goal is to efficiently transfer heat from heat-generating components to ambient air within the limited chassis space of the server with high-static-pressure fans, keeping the chip operating at a safe temperature (typically ≤85℃).