Copper Base: These two copper components are usually Insulated Metal Substrates (IMS) or Vapor Chambers (VC). Compared with solid aluminum, oxygen-free copper features an extremely high thermal conductivity, which can rapidly spread heat concentrated at a single point or along a line over a larger area.
Densely Packed Extruded Aluminum Fins + Heat Pipes: After the copper block evenly distributes the heat, the aluminum fins create an extensive heat dissipation area. Combined with forced air cooling, highly efficient heat dissipation is achieved. This configuration maximizes the superior thermal conductivity of copper while taking advantage of the cost-effectiveness of aluminum for heat dissipation, making it a classic solution for high-end thermal management.