Cold Plate Customization Process
Microchannel Heat Sink Manufacturer – Liquid Cold Plate & Vapour Chamber for High Power Electronics
Microchannel Heat Sink
Due to the rapid growth of power consumption of the chip, single chip power consumption increased to 300W ~ 500W, close to the limit of traditional cooling technology. And high power consumption chip into the mobile platform, equipment modularity, integration for the lightweight heat sink, miniaturization demand is also growing. Microchannel heat sinks have the advantages of high thermal conductivity, small size, small heat transfer group, etc., in high-performance electronic equipment, power electronic equipment, renewable energy systems and other applications have shown good thermal performance, is a highly efficient thermal management program. Microchannel heat sinks utilize the microfluidic principle to increase the ratio of surface area to volume, and are able to accelerate the heat transfer from the heat source to the coolant flowing through the microchannel.
CGcooler Microchannel Heat Sink
CGcooler microchannel heat sink is mainly divided into microchannel liquid cooler and microchannel vapour chamber.
Microchannel Vapour Chamber
CGcooler micro-channel thermostats are lightweight, shaped, and nestable, and can be integrated with liquid and air cooling systems.In industrial-grade heat dissipation for servers, power and other applications.
Microchannel Liquid Cooler
CGcooler’s microchannel liquid coolers can optimize channel geometry, flow arrangement and coolant selection to meet customer cooling requirements, providing excellent cooling performance in water-cooled systems. They are widely used in electric vehicles, wind power generation, solar power generation, train traction machines, charging piles, servers and other industrial cooling applications.
1.Material Innovation
CGcooler develops innovative composite systems in heat sink solutions.
Metal materials :CGcooler explores the application of porous copper materials in microchannel construction, and builds a metal composite material system with high thermal conductivity.
Phase change materials: alkanes and fatty acids, with high latent heat, non-toxic, non-corrosive, low cost characteristics. Then add graphite, carbon nanotubes, graphene oxide, nano-graphite sheets, metal foam and other inorganic or metallic materials to improve the performance of phase change materials.
2.Structural Innovations
CGcooler has innovated an ultra-thin microchannel structure to build a multi-layer functional composite microstructure that improves bonding precision and strength while effectively increasing the thermal conductivity of the bonded layer.
CGcooler’s professional R&D and design team has innovated microchannel designs such as dot matrix and honeycomb structures, which can reduce contact thermal resistance, improve heat transfer efficiency and reduce weight. Simulation software is used to simulate the heat transfer process, phase change process and temperature change to guide the optimization and improvement of the heat sink.
3.Process Innovation
CGcooler micro-channel heat sink adopts composite structure micro-channel heat dissipation technology to optimize the design, combined with integrated UV-LIGA process, recreating the microfluidic heat transport system, and dramatically improving the heat dissipation capability of the microfluidic system. It also adopts vacuum brazing, instantaneous liquid phase diffusion welding and other welding technologies.
Multi-dimensional heat dissipation technology
Integration of single-phase heat dissipation and gas-liquid two-phase flow heat dissipation. Chaotic and random nature of gas-liquid flow, combination of network topology and microstructure to ensure heat dissipation efficiency.
Flexible Structure Adaptation Technology
CGcooler microchannel heat sinks are capable of shaped design, non-planar structure design adaptability to the heat dissipation environment.
Adaptability to Complex Working Conditions
CGcooler microchannel heat sink is made of lightweight materials and independent heat dissipation system. The heat sink can be integrated with liquid cooling and air cooling systems for a more efficient cooling system.