Bga heatsink
Bga Heatsink
Ball Grid Array (BGA) is used to cool integrated circuits, and the device encapsulated by this technology is a surface mount device. BGA packaging appeared in the early 1990s, and has developed into a mature high-density packaging technology. cgcooler provides a series of BGA heat sink and cooling solutions for cooling integrated circuit and integrated circuit with ball gate array (BGA) surface mount packaging.
BGA Heat Sink Manufacturer – Custom Aluminum Heat Sink for Ball Grid Array Packages
What is a bga heatsink
The heatsink installed on BGA device are called BGA heatsink, but they are actually simple aluminum extruded heatsink design to cooling the BGA device. cgcooler currently has extensive BGA heat sink ,wihich have various sizes, fin types.
In today’s information age, people have more and more requirements on functions and performance of electronic products, while the volume requirements are smaller and the weight requirements are lighter and lighter. BGA’s advanced high density packaging technology promotes the realization of the development goal of electronic products towards multi-function, high performance, miniaturization and lightening. So BGA heat sink is very small, and the attachment of the heat sink is a big challenge. Currently, the heat sink can be either attached to the device or to the PCB boards in a variety of ways, including clip connections, solder anchors, push pins, hot tape/epoxy resins, and easy to assemble tape, etc. Hot tape/epoxy resins are a common method for quick and easy installation to your equipment.
CGcooler heat sink designed for BGA package
CGcooler provide a new cooling solution for IC with ball gate array (BGA) packaging. The new BGA heat sink is targeted at traditional high capacity motherboards, video CARDS and networking card applications.
CGcooler company provides standard and OEM BGA cooling solutions. Low-end customized products include accessories, interface materials and fans selected by customers. Other customization services include decorative and structural modifications to fins, as well as tagging and graphics.
The company also supports BGA emerging markets such as personal computers and consumer electronics products with high-end design optimizations that meet thermal performance requirements and brand objectives such as providing OEM customers with images that reflect the company or brand.
In addition, the company supports existing OEM designs that integrate BGA packaging with thermal solutions for graphics and mechanical design services, thermal analysis, mechanical analysis, thermal detection and fan life detection.For customers in the early stages of design, cgcooler offers design engineering support, testing equipment, and full prototyping capabilities to ensure rapid design cycles.
Bga heatsink type and features
Bga heat sink have various type, such as Bga extruded fin heatsink ,Bga aluminum extruded fin heatsink,Bga aluminum round pin heatsink,Bga aluminum square pin fin heatsink,Bga aluminum copper pin heatsink,Bga fan heatsink, Bga plate fin heat sink, Bga push pin heat sink, Bga heat sink with cross cutting, etc.
Features:
- Aluminum BGA heat sink is low profile.
- high efficiency cooling product which is ideal for linear air flow environments
- made from thermal conductivity 6063-T5 aluminum for optimum heat transfer
- Designed specifically for BGA and other surface mount package
- Finished with black or silver anodized.
Bga heat sinks examples
PART NUMBER | TYPE | MATERIAL | STYLE | LENGH(MM) | WIDTH(MM) | HEIGHT(MM) | DETAILS |
| LR0140 | BGA | Aluminum | Cross Cut | 12 | 12 | 10 | View |
| LR0139 | BGA | Aluminum | Cross Cut | 24 | 14 | 10 | View |
| SR9324 | BGA | Aluminum | Cross Cut | 20 | 20 | 10 | View |
| SR9325 | BGA | Aluminum | Push Fin | 25 | 25 | 10 | View |
| LR0133 | BGA | Aluminum | Cross Cut | 28 | 28 | 20 | View |
| SR9321 | BGA | Aluminum | Push Fin | 35 | 35 | 10 | View |
| SR9323 | BGA | Aluminum | Cross Cut | 40.5 | 40.5 | 10 | View |
| SR9322 | BGA | Aluminum | Plate Fin | 50 | 50 | 10 | View |